On-line vacuum plasma equipment PR-IL05-S
PR-IL05-S
Features:
1. The movement module of the feeding line adopts servo motor + ball screw module movement, which effectively ensures accuracy and reduces dust;
2. There are 2 tracks built in the vacuum chamber, which can process 2 pieces of materials at a time, and the UPH can reach 90 pieces board/hour;
3. All motion mechanisms adopt a mature motion scheme, and the stability and failure rate of the equipment can be effectively controlled.
Online query
1. The movement module of the feeding line adopts servo motor + ball screw module movement, which effectively ensures accuracy and reduces dust;
2. There are 2 tracks built in the vacuum chamber, which can process 2 pieces of materials at a time, and the UPH can reach 90 pieces board/hour;
3. All motion mechanisms adopt a mature motion scheme, and the stability and failure rate of the equipment can be effectively controlled.
| Number | Content | Specification Parameters |
|---|---|---|
| 1 | Machine Specifications | L1300mm*W1300mm*H2200﹢50/﹣30mm (including FFU and alarm indicator light, etc.) |
| 2 | In and out of the way | Automatic feeding and discharging of assembly line |
| 3 | Discharge structure | Vacuum capacitive glow discharge |
| 4 | Processing temperature | ≤50℃ |
| 5 | Number of plates processed at a time | 2片 |
| 6 | The maximum size of the carrier board | （170-270）*（65-85）*（1-5）mm |
| 7 | Equipment capacity | Theoretical value ≥ 90 carriers/hour (calculated based on the plasma processing time of 15 seconds) |
| 8 | Purification Protection | Hundred-level FFU purification and filtration system |
| Features: 1. The movement module of the feeding line adopts servo motor + ball screw module movement, which effectively ensures accuracy and reduces dust; 2. There are 2 tracks built in the vacuum chamber, which can process 2 pieces of materials at a time, and the UPH can reach 90 pieces board/hour; 3. All motion mechanisms adopt a mature motion scheme, and the stability and failure rate of the equipment can be effectively controlled. Uses: In IC packaging, the design requirements for the automatic material handling of the online vacuum plasma cleaning machine before the process of dispensing glue on the lead frame, chip bonding and plastic packaging, etc. Compared with the conventional plasma cleaning system, it reduces the cost of manual handling. Improve equipment automation level. |
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