Wiring is the gold wiring between the electrical chip and the optical chip as well as between the electrical chip and the PCB pad. Before wiring, plasma cleaning machine is used to activate the surface so that it can reach a stable connection. Solidification and wire is very important, wire need to meet the tension test, the length of the wire also has certain requirements, too long or too short will affect the actual performance, such as sensitivity, emission eye pattern, optical module failure analysis has wire fracture and other factors, in this process, plasma is played a vital role.