Number | Content | Specification Parameters |
---|---|---|
1 | Machine specifications | 2000(W)×1500(D)×1960(H) mm |
2 | Vacuum Chamber Specifications | 1030(W)×1100(D)×1070(H) mm |
3 | Electrode Specifications | 17-layer flat electrode plate(944W×790 D mm (28W ×24D in)) |
4 | Control System | PC industrial control system + PLC automatic control |
5 | Vacuum measurement system | Pirani resistance vacuum gauge |
6 | Gas Metering System | Accurate mass flow controller MFC |
7 | Number of gas channels | 2-5 working gases are optional: Ar2, N2, H2, CF4, O2 |
8 | Plasma generator | 10KW plasma source (40KHz, optional 13.56MHz) |
9 | Working gas | 2 working gases are optional: Ar2, N2, H2, O2 |
Features: High precision, fast response, good handling and compatibility, perfect functions and professional technical support. Uses: Suitable for camera and industry, mobile phone manufacturing, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc. 1. Printed circuit board industry: surface activation of high-frequency boards, surface cleaning and desmearing of multi-layer boards, surface cleaning and desmearing of soft boards and soft-rigid boards, activation of soft boards before reinforcement. 2. Semiconductor IC field: COB, COG, COF, ACF process, used for wire bonding and cleaning before welding; 3. Silica gel, plastic, polymer field: surface roughening, etching, and activation of silica gel, plastic, and polymer . |
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