PCB Water Plasma Processor OKSUN-PM17A
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Number Content Specification Parameters
1 Machine specifications 2000(W)×1500(D)×1960(H) mm
2 Vacuum Chamber Specifications 1030(W)×1100(D)×1070(H) mm
3 Electrode Specifications 17-layer flat electrode plate(944W×790 D mm (28W ×24D in))
4 Control System PC industrial control system + PLC automatic control
5 Vacuum measurement system Pirani resistance vacuum gauge
6 Gas Metering System Accurate mass flow controller MFC
7 Number of gas channels 2-5 working gases are optional: Ar2, N2, H2, CF4, O2
8 Plasma generator 10KW plasma source (40KHz, optional 13.56MHz)
9 Working gas 2 working gases are optional: Ar2, N2, H2, O2
Features: High precision, fast response, good handling and compatibility, perfect functions and professional technical support.

Uses: Suitable for camera and industry, mobile phone manufacturing, semiconductor IC field, silicone, plastic, polymer field, automotive electronics industry, aviation industry, etc.

1. Printed circuit board industry: surface activation of high-frequency boards, surface cleaning and desmearing of multi-layer boards, surface cleaning and desmearing of soft boards and soft-rigid boards, activation of soft boards before reinforcement.
2. Semiconductor IC field: COB, COG, COF, ACF process, used for wire bonding and cleaning before welding;
3. Silica gel, plastic, polymer field: surface roughening, etching, and activation of silica gel, plastic, and polymer .
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