Number | Content | Specification Parameters |
---|---|---|
1 | Type | Plasma Cleaning |
2 | Model | Type A/M/D: 100~3270mm (handling width) |
3 | Constitute | Plasma power supply, UT gas control unit, plasma electrode unit |
4 | Process gas | N2 + CDA |
5 | Processing spacing | 3~12mm |
6 | Processing temperature | ≤50ºC |
7 | Drop angle | ≤10°(100mm/s) |
Product advantages: 1. Better treatment effect: The surface value of discharge is increased to 50mm, which can improve the cleaning effect by 3~5 times compared with ordinary atmospheric pressure plasma cleaners. 2. Faster processing speed: up to 8M/min. 3. Lower process temperature: the lowest process temperature is ≤40ºC, which effectively protects the product and does not cause thermal damage. 4. More stable process control: The plasma discharge is more stable, does not generate arcs, and does not generate electrical damage. 5. Lower cost of use: Nitrogen (N₂) and compressed air (CDA) are used as process gases, nitrogen generators are available, and maintenance costs are low. 6. Less generation of dust: Unique electrode structure and processing method minimizes particle generation Product application: 1. Widely used in LCD (2G~11.5G) and OLED production processes. 2. Widely used in TP (touch screen) production process. 3. AF coating (anti-fingerprint), AS coating (anti-scratch), AG coating (anti-glare), AR coating (anti-reflection) pre-treatment. 4. The pre-treatment of the full bonding of the display screen and the pre-treatment of the ACF pressing of the display screen. 5. Metal film (Cu, Al, etc.), non-metal film (PET, PI, etc.) coil coating, surface treatment before bonding. |
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